Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging

To strengthen our team at our main site in Planegg-Martinsried near Munich, we are looking for you with immediate effect as Development Engineer (m/f/d) for photonic integrated circuitry (PIC) Testing & Packaging Your tasks Prototype thermal, electrical, and optical packaging solutions for chips Develop the infrastructure and processes for the testing and packaging of optical chips at Menlo Systems Work as part of a team on the realization of PIC-based light sources, such as frequency combs and supercontinua Your profile Completed university degree in the field of optical engineering, electrical engineering or physics First professional experience as a development engineer for PIC, either in an industrial environment or equivalent experience, e.g., in the framework of a PhD Knowledge and experience in at least two of the following areas: photonic integrated circuitry, packaging, electronics, mechanical design, laser physics, photonics Communication and teamwork skills with a high degree of initiative and persuasiveness Good knowledge of written and spoken German and English We offer Exciting and challenging tasks in a growing market A highly motivated team, with creative freedom Flexible working hours and 30 days of vacation Individual and practice-oriented training Opportunities for professional development Easily-reached location by public transport and by car A subsidy for public transport, alternatively bicycle leasing or a free parking space We look forward to receiving your application!

5 ■ 82152 Planegg-Martinsried ■ Phone: +49 89 189 166 0 www.menlosystems.com