Packaging Design Expert - Power Module in Automotive semiconductor industry (m/f/d) in München
Company Profile:
Our customer is R&D Center in Munich, which belongs to a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide safer, more comfortable, and more convenient products and services.
Duties and responsibilities:
- Track industry technology trends and develop packaging technology roadmaps for power modules;
- Responsible for power module product definition, develop power module product roadmap;
- Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes;
- Leading team to complete the technical development of advanced power module, output design and process files;
- Support product development team to finish product development and import to factory for mass production.
Requirements:
Education/Experience- Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors;
- More than 8 years of experience in power semiconductor packaging product development or technology research and developmen...
Hinweis: Dies ist eine gekürzte Anzeige von MINTbund.de - MINT Stellen aus Deutschlandweit.
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Schlagworte: Semiconductor, Automotive, R&D, Power Module, SiC, power semiconductor packaging, thermal simulation, packaging, packaging solutions, Englisch, Elektrotechnik, Maschinenbau, Physik, Elektroniker, Messtechnik, Mechatroniker, Simulation, Electronics, Elektronik, Servicetechniker.
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