Simulation Design Expert - Power Module in Automotive semiconductor industry (m/f/d) in München
Company Profile:
Our customer is R&D Center in Munich, which belongs to a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide safer, more comfortable, and more convenient products and services.
Duties and responsibilities:
- Responsible for the development of power module electromagnetic and circuit models include Spice model, optimizing power module electrical design, chip selection, and solving difficult problems such as oscillation, current sharing, crosstalk, and circulation current;
- Responsible for the thermal resistance simulation, flow resistance simulation and various working condition temperature simulations of the power module, and optimizing the thermal design of the power module, completing the development of the electrothermal coupling simulation model of the power module;
- Leading the power module packaging process simulation such as warpage, thermal mechanical stress, mold flow simulation, optimizing power module design, tooling fixture solution and key process parameters;
- Aim to find root cause for power module reliability issues using simulation method, and complete lifetime assessment model and DFR for power modules;
- Leading the continuous optimization of the power module simulation platform, defining a fast, robust, and automated simulation workflow, improving model accuracy based on experimental results, and realizing product virtual design and digital engineering;
- Respo...
Hinweis: Dies ist eine gekürzte Anzeige von MINTbund.de - MINT Stellen aus Deutschlandweit.
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Schlagworte: Semiconductor, Automotive, R&D, Power Module, SiC, power semiconductor packaging, Simulation, thermal simulation, stress & reliability simulation, electrical simulation, mold flow simulation.
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